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OEM Prototype BGA PCB Assembly Circuit Board for Communication Module

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    Buy cheap OEM Prototype BGA PCB Assembly Circuit Board for Communication Module from wholesalers
     
    Buy cheap OEM Prototype BGA PCB Assembly Circuit Board for Communication Module from wholesalers
    • Buy cheap OEM Prototype BGA PCB Assembly Circuit Board for Communication Module from wholesalers

    OEM Prototype BGA PCB Assembly Circuit Board for Communication Module

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    Certification : ISO, UL, IPC, Reach
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    Payment Terms : T/T
    Delivery Time : 5-30 days
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    OEM Prototype BGA PCB Assembly Circuit Board for Communication Module


    Communication Module BGA PCB Prototype and Assembly


    What Is PCB Prototype and Assembly?


    PCB Prototype​​ and ​​PCB Assembly​​ are two critical stages in the development of electronic circuits. They involve designing, testing, and manufacturing printed circuit boards (PCBs) before full-scale production.

      • ​​Higher density connections​​ (more I/O in a smaller space)
      • ​​Better electrical & thermal performance​​ (shorter signal paths, improved heat dissipation)
      • ​​Reduced risk of bent or damaged pins​​ (since there are no leads)

    ​​1. PCB Prototype​​

    A ​​PCB prototype​​ is an early-stage sample of a circuit board used for testing and validation before mass production.

    ​​Key Steps in PCB Prototyping:​​

      1. ​​Design & Layout​​ – Using CAD software (e.g., Altium, KiCad) to create schematics and PCB layouts.
      2. ​​Fabrication​​ – Manufacturing a small batch of bare PCBs (no components yet).
        • ​​Methods:​​
          • ​​CNC Milling​​ (for quick, low-cost prototypes)
          • ​​Chemical Etching​​ (DIY or small-scale)
          • ​​Professional PCB Fabrication​​ (from companies like JLCPCB, PCBWay)
      3. ​​Testing​​ – Checking for design flaws, signal integrity, and thermal performance.

    ​​Why Prototype?​​

    ✔ ​​Verify functionality​​ before mass production
    ✔ ​​Detect design errors​​ (e.g., short circuits, incorrect footprints)
    ✔ ​​Optimize performance​​ (signal routing, power distribution)


    2. PCB Assembly (PCBA)​​

    ​​PCB Assembly (PCBA)​​ is the process of soldering electronic components onto a bare PCB to create a functional board.

    ​​Types of PCB Assembly:​​

      1. ​​Through-Hole Assembly (THA)​​ – Components with leads inserted into holes and soldered (used for robust, high-power circuits).
      2. ​​Surface-Mount Assembly (SMT/SMD)​​ – Components placed directly onto PCB pads (faster, more compact, used in most modern electronics).
      3. ​​Mixed Assembly​​ – Combines both SMT and through-hole components.

    ​​PCB Assembly Process:​​

      1. ​​Solder Paste Application​​ – A stencil deposits solder paste on PCB pads.
      2. ​​Component Placement​​ – A pick-and-place machine positions SMD components.
      3. ​​Reflow Soldering​​ – The board passes through an oven to melt solder paste.
      4. ​​Inspection & Testing​​ – Automated Optical Inspection (AOI), X-ray (for BGAs), and functional testing.

    ​​♦ Prototype vs. Mass Production Assembly​:


    FeaturePrototype AssemblyMass Production Assembly
    ​Volume​Low (1-10 units)High (100s–1000s)
    ​Cost per Unit​Higher (manual setup)Lower (automated)
    ​Turnaround Time​Faster (days)Slower (weeks)
    ​Flexibility​Easier to modifyHarder to change

    Technical Parameters


    PCB Assembly Capability

    Item

    Normal

    Special

    SMT

    Assembly

    PCB(used for SMT)

    specification

    Length and Width( L* W)

    Minimum

    L≥3mm, W≥3mm

    L<2mm

    Maximum

    L≤800mm, W≤460mm

    L > 1200mm, W>500mm

    Thickness( T)

    Thinnest

    0.2mm

    T<0.1mm

    Thickest

    4 mm

    T>4.5mm

    SMT components specification

    Outline Dimension

    Min size

    0201(0.6mm*0.3mm)

    01005(0.3mm*0.2mm)

    Max size

    200 * 125

    200 * 125

    component thickness

    T≤15mm

    6.5mm<T≤15mm

    QFP,SOP,SOJ

    (multi pins)

    Min pin space

    0.4mm

    0.3mm≤Pitch<0.4mm

    CSP/ BGA

    Min ball space

    0.5mm

    0.3mm≤Pitch<0.5mm

    DIP

    Assembly

    PCB specification

    Length and Width( L* W)

    Minimum

    L≥50mm, W≥30mm

    L<50mm

    Maximum

    L≤1200mm, W≤450mm

    L≥1200mm, W≥500mm

    Thickness( T)

    Thinnest

    0.8mm

    T<0.8mm

    Thickest

    3.5mm

    T>2mm


    Advantages of DQS Team
    1. On-time Delivery:
      • Owned PCBA factories 15,000 ㎡
      • 13 fully automatic SMT lines
      • 4 DIP assembly lines

    2. Quality Guaranteed:

      • IATF, ISO, IPC, UL standards
      • Online SPI, AOI, X-Ray Inspection
      • The qualified rate of products reach 99.9%

    3. Premium Service:

      • 24H reply your inquiry
      • Perfect after-sales service system
      • From prototype to mass production

    Would you like details on ​​PCB Prototype and Assembly?

    Contact us via email : sales@dqspcba.com



    Quality OEM Prototype BGA PCB Assembly Circuit Board for Communication Module for sale
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