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8-layer ENIG HDI PCB High Component Density For 5G Communication Equipment
♦ What is HDI PCB?
HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.
♦ Characteristics of HDI PCB
♦ Applications of HDI PCB
♦ Technical Parameters
Item  | Spec  | 
Layers  | 1~64  | 
Board Thickness  | 0.1mm-10 mm  | 
Material  | FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc  | 
Max Panel Size  | 800mm×1200mm  | 
Min Hole Size  | 0.075mm  | 
Min Line Width/Space  | Standard: 3mil(0.075mm) Advance: 2mil  | 
Board Outline Tolerance  | 士0.10mm  | 
Insulation Layer Thickness  | 0.075mm--5.00mm  | 
Out Layer Copper Thickness  | 18um--350um  | 
Drilling Hole (Mechanical)  | 17um--175um  | 
Finish Hole (Mechanical)  | 17um--175um  | 
Diameter Tolerance (Mechanical)  | 0.05mm  | 
Registration (Mechanical)  | 0.075mm  | 
Aspect Ratio  | 17:01  | 
Solder Mask Type  | LPI  | 
SMT Min. Solder Mask Width  | 0.075mm  | 
Min. Solder Mask Clearance  | 0.05mm  | 
Plug Hole Diameter  | 0.25mm--0.60mm  | 
                                 
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